ASCENTECH LLC

Distributor and Sales Agents

Ionic Contamination Test, Solderability Test, SIR & CAF, Optical Inspection, SMT Stencil Cleaning

What are the Applications?

Optical Inspection, recording, analysis and documentation of:

  • BGA
  • μBGA as low as 40 microns stand-off
  • CSP
  • Flip-Chip
  • SMT Solder Joints
  • Printed Solder Paste
  • ASsembled PCBs
  • Stencil Apertures
  • Components, pad, scores, connectors, cables

BGA INSPECTION Camera